Semiconductor Laser Repair Machine REV-323-ZW

Equipment introduction:

Semiconductor laser repair machine is a precision processing and repair equipment specially developed for semiconductors, microelectronics and other fields. The core is used for high-precision laser repair operations.

The equipment is equipped with a special laser (laser) system, a precision optical imaging system (including a special microscope for laser processing/observation, a special optical objective for laser processing, and an image observation objective), an X/Y/Z three-axis manual displacement and focusing system, supplemented by a precision marble platform base and a simple open work carrier form a highly stable processing system. The equipment is deeply adapted to the entire process needs of the semiconductor industry chain and can be widely used in laboratory analysis, packaging and manufacturing, R & D debugging, and process defect repair. It can accurately strip and repair defects on specific material layers of workpieces, effectively reducing product scrapping rate, significantly reducing production costs.

Basic information

Technical characteristics and advantages

● High-end core configuration is supported, leading the industry in repair stability ● Multi-dimensional and precise control to adapt to complex repair scenarios ● Comprehensive optical imaging system for more accurate defect identification and repair ● Strong flexible adaptation capabilities ● Software functions are more suitable for industrial-level operation needs ● The balance of customization and compatibility is more advantageous

Application field

Precision machining and repair in the fields of semiconductors and microelectronics (core applications of laser micromachining systems)

 Polyimide (PI) semiconductor packaging layer peeling

• Core advantages: 3-5μm thick encapsulation layer is stripped, the efficiency is 3-5 times that of FIB, and there is no ion pollution

Application scenarios:

• Failure Analysis Laboratory: Fault Location within the Chip

• Power chip packaging rework: repair of defective IGBT modules

• Advanced packaging R & D: 2.5D/3D packaging PI layer trimming

Surface removal of silicon dioxide (SiO₂) circuit metal lines

• Core advantage: Remove the SiO₂ layer on the surface of the metal line without damaging the metal line below

Application scenarios:

• Semiconductor device production line: CMOS chip insulation repair

• MEMS sensor development: pressure sensor film adjustment

• RF chip manufacturing: GaN chip passivation layer treatment

Metal circuit (gold/aluminum) wire cutting and capacitor trimming

• Core advantages: Circuit line cutting and capacitor size trimming to avoid damage to silicon/gallium arsenide substrate

Application scenarios:

• Failure analysis and verification: chip short circuit fault confirmation

• RF chip debugging: power amplifier chip parameter matching

• Wafer test post-processing: Poor isolation of logic chips

Core equipment for reducing costs (rework), improving yields (repair), and accelerating R & D (debugging) in the semiconductor industry

1. Machine specifications

2. Laser system

2-1 You can choose New Wave, REV-3018 and other series laser systems, according to the cutting material configuration requirements.

(Subject to the actual laser configuration).

3. Operation mode

3-1 Software features no

(1) Laser control box

(2)Laser manual operation firing function (foot pedal).

(3)Manual XYZ three-axis displacement focus, and the screen cursor moves.

(4)The matching settings of standard parameters of the control box are adjustable.

(5)The control box knob turns on the Slit function. The cursor movement on the screen corresponds to the adjustment of Slit size.

(6)User login/login key power switch.

(7)Manual adjustment of upper and lower light sources.

(8)The upper and lower light sources are adjusted manually in conjunction with each magnification setting.

(9)Lens switching manual correction function.

(10)Operate the English menu.

3-2 In manual operation mode, the operator can manually adjust and move XYZ and confirm it through the system screen.

4. Public equipment

5. appearance

6. use environment